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ElectroComponent Science and Technology
Volume 6, Issue 3-4, Pages 127-130

Silicone Resin and Elastomer Protection of Hybrid Circuits

Dow Corning Limited, South Glamorgan, Barry, United Kingdom

Received 4 April 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Developments in encapsulants, in particular in relation to stress and humidity protection, are examined. Superior protection can now be achieved with flexible room temperature curing silicone encapsulants.