Active and Passive Electronic Components

The Second European Hybrid Microelectronics Conference. Part I


Status
Published

The Second European Hybrid Microelectronics Conference. Part I

Articles

  • Special Issue
  • - Volume 6
  • - Article ID 205804

State of the Art in Design and Technology of SAW Devices

P. E. Lagasse
  • Special Issue
  • - Volume 6
  • - Article ID 285278

A User Made Thick Film System

M. Honore | R. Govaearts | ... | V. Jansoone
  • Special Issue
  • - Volume 6
  • - Article ID 650293

1 GHz Low-Noise Hybrid Preamplifier for Optical Detection

O. Monti | A. Scavennec | P. le Men
  • Special Issue
  • - Volume 6
  • - Article ID 416519

State of the Art in Thin Film Transistor: A Review of the Used Insulator–Semiconductor Combinations

André van Calster | Alexis de Vos
  • Special Issue
  • - Volume 6
  • - Article ID 979602

An Installed Tape Automated Bonding Unit

Karel Kurzweil
  • Special Issue
  • - Volume 6
  • - Article ID 869832

An Improved Thick Film Aluminium Conductor Process

R. E. Cooper | P. F. T. Linford | J. Savage
  • Special Issue
  • - Volume 6
  • - Article ID 273576

Some Observations on the Accelerated Ageing of Thick-Film Resistors

F. N. Sinnadurai | P. E. Spencer | K. J. Wilson
  • Special Issue
  • - Volume 6
  • - Article ID 385924
  • - Short Communication

Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices

P. E. K. Donaldson
  • Special Issue
  • - Volume 6
  • - Article ID 168085

A Technique for the Measurement of Hot Spots and Isotherm Profiles at the Surfaces of the Elements of Hybrid Microcircuits

F. N. Sinnadurai
  • Special Issue
  • - Volume 6
  • - Article ID 267812

Silicone Resin and Elastomer Protection of Hybrid Circuits

Brian R. Trego
Active and Passive Electronic Components
 Journal metrics
Acceptance rate14%
Submission to final decision54 days
Acceptance to publication35 days
CiteScore1.100
Impact Factor-
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