Capacitors have been prepared from N2-doped, triode sputtered Tantalum films by conventional anodization and
photolitographic techniques.NiCr&#8211;Au, Ta&#8211;Ti&#8211;Pd&#8211;Au, Ta&#8211;NiCr&#8211;Pd&#8211;Au have been used as counterelectrode materials and the a.c. and d.c. properties of the capacitors have been compared.It has been found that a doped Ta thin layer deposited by sputtering between the dielectric and the top electrode
does not negatively affect the capacitors characteristics; moreover, a thermal treatment at temperatures as high
as 350&#8451; can be tolerated.If the Ta film deposited after the dielectric formation is used for resistive elements, a fully compatible R&#8211;C
process is obtained which requires only two vacuum deposition cycles and four photolithographic steps.

G. P. Ferraris

R.  May

Tantalum Thin Film Capacitors With Various Types of
Counterelectrodes

New conductor pastes have made possible great improvements in the loss characteristics of thick film microwave
integrated circuits. This paper presents data on the microwave characteristics of transmission structures made from
newly developed copper, silver and gold conductor pastes on alumina and garnet substrates. The resistivity and
microstructure for each conductor material was examined for correlation with microwave properties. These data
show that thick film circuits can give excellent performance through 18 GHz.

R. Wayne Johnson

Phil W. Rich

Debbie D. Rich

Larry K. Wilson

Advances in Thick Film Conductors for Microwave Integrated Circuits

Two different systems of light-sensitive resist materials precoated on carrier foils and their potential applications for
thickfilm-technology and high quality printed circuits are described. In addition to 25 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m diazo screen printing film
already accepted in this field, new experimental films up to 70 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m thickness can be provided. They show excellent
shelf-life and can be transferred to the screen and developed after exposure simply with water. The second system is
a 12 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m positive dry film resist based on the same chemistry as all positive liquid resists. After lamination to a
substrate it can be exposed directly on the resist. It gives better resolution than negative dry film resists and offers a
potential for multiple exposure. Thicker positive dry films are possible using a new positive system without diazo
compounds.

H.  Ruckert

New Light-Sensitive Positive-Working Thick Resist Materials for
Various Electronic Applications

A modified version of the computer programme SINC-S is described which permits the user to specify independently
up to 30 different device temperatures in a given problem when the proper control statement is included. An
additional option is an algorithm for the steady-state solution of a non-linear network with periodic inputs, so that
realistic system operation may be simulated. The programme may be used to provide more accurate simulation of
circuits where large temperature gradients are present, and to furnish input data for other thermal analysis
programmes

Carl R. Zimmer

A Computer Programme With Temperature Gradient Capability for the
Network Analysis of Hybrid Circuits

It is only in the last ten years or so that solid state physics has had the temerity to consider that real solids are
neither perfect nor pure, whereas for many years all resistors of reasonable quality have been impure, highly doped,
and clearly disordered in structure. As solid state theory has developed there have been attempts to understand the
resistor problem but until now, with hindsight, we can say that the tools required have not been available. The
situation is, even now, not perfectly clear but there is sufficient information available to make a critical assessment
of the methods that can be applied and to indicate where the solution to the problem of carrier transport in resistor
materials might lie.

Robert M. Hill

Electrical Transport in Thick Film Resistors

Complete testing and high speed automated assembling are the main advantages which are offered by the technology
called Tape Automated Bonding (TAB). The main step in this technology is a bumping of wafers which is usually
performed by the IC manufacturers. When the bumped wafers are not available, the hybrid circuit manufacturers
are forced to bump wafers themselves. As the bumping process consists of several operations requiring many
preliminary steps, a new bumping process which is based on ultrasonic bonding of the preformed gold bumps to the
aluminium pads of chips has been suggested. Compatibility of such bumped chips with TAB and the shear strength
of those bumps were tested.

Karel  Kopejtko

Jind&#345;ich  Vil&#237;m

An Alternative Way of Making Bumps for Tape Automated Bonding

This paper describes the state of the art in the development of a polymer based printed circuit board (PCB)
compatible resistor ink system. The subject is treated from the standpoint of the manufacturer who, up to now,
supplied himself with PCB circuitry.

M.  Honore

R.  Govaearts

D.  Hostens

B.  Bouw

B.  Matton

V.  Jansoone

A User Made Thick Film System

A 1 GHz low- noise preamplifier, especially designed for photodetection purposes is described. The amplifier noise
which sets a limit to the sensitivity of the photodiode-preamplifier combination is minimized using a hybrid technology
which allows very low values of the parasitics. Results on a complete photodiode-equalized preamplifier are
given.

O.  Monti

A.  Scavennec

P.  le Men

1 GHz Low-Noise Hybrid Preamplifier for Optical Detection

In this paper the different classes of surface acoustic wave devices are briefly reviewed and examples of the state of
the art are given. The fabrication techniques and the application of SAW components are also discussed.

P. E. Lagasse

State of the Art in Design and Technology of SAW Devices

P. E. K. Donaldson

Helium Leak Measurements as a Predictor of
Hermetic Package Life in Surgically-implanted Microelectronic
Devices

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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Active and Passive Electronic Components

This Issue is now open for submissions.
Papers are published upon acceptance, regardless of the Special Issue publication date.

Active and Passive Electronic Components

The Second European Hybrid Microelectronics Conference. Part I

The Second European Hybrid Microelectronics Conference. Part I

Articles

Tantalum Thin Film Capacitors With Various Types of Counterelectrodes

Advances in Thick Film Conductors for Microwave Integrated Circuits

New Light-Sensitive Positive-Working Thick Resist Materials for Various Electronic Applications

A Computer Programme With Temperature Gradient Capability for the Network Analysis of Hybrid Circuits

Electrical Transport in Thick Film Resistors

An Alternative Way of Making Bumps for Tape Automated Bonding

A User Made Thick Film System

1 GHz Low-Noise Hybrid Preamplifier for Optical Detection

State of the Art in Design and Technology of SAW Devices

Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices