Table of Contents Author Guidelines Submit a Manuscript
ElectroComponent Science and Technology
Volume 6 (1980), Issue 3-4, Pages 215-218

Advances in Thick Film Conductors for Microwave Integrated Circuits

Department of Electrical and Biomedical Engineering, Vanderbilt University, Nashville, Tennessee, USA

Received 24 August 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


New conductor pastes have made possible great improvements in the loss characteristics of thick film microwave integrated circuits. This paper presents data on the microwave characteristics of transmission structures made from newly developed copper, silver and gold conductor pastes on alumina and garnet substrates. The resistivity and microstructure for each conductor material was examined for correlation with microwave properties. These data show that thick film circuits can give excellent performance through 18 GHz.