Abstract
This paper presents the evaluation results of thermocompression GANG Bonding of gold-plated TAB outer leads to
three kinds of metallized ceramic substrates. Gold-Selective Plating (GSP) substrates for multi-chip package, Thick
Film (TF) substrates for multi-chip package and Single Chip Packages (SCP) which have a trimetal combination of
refractory metal (tungsten), Nickel and Gold.The bonding parameters such as the bonding tool (thermode) temperature, pressure, bonding time and preheat
temperature were examined on each substrate to get optimum values. As the result, a relation between pull strength
and the lead deformation shows that the TAB leads should be bonded with 15–65 percent deformation, the recommended parameters are; the tool temperature of 380–430℃, the bonding pressure ranging from 35 to
45 kg/mm2, with the preheat temperature of 150℃ and the bonding time from 1.0 to 2.5 seconds.The evaluation of initial bondability shows that TAB GANG Bonding has the capability of excellent bonding
strength; above 120 grams with standard deviation of less than 20 grams, and the necessity of OLB pads flatness; less
than ±12