Active and Passive Electronic Components

International Microelectronics Conference. Part I


Status
Published

International Microelectronics Conference. Part I

Articles

  • Special Issue
  • - Volume 8
  • - Article ID 430707

Announcement

  • Special Issue
  • - Volume 8
  • - Article ID 530708

Automatic Production System for Circuit Boards With Universal Hybrid Integrated Circuits

Mitsuo Ohsawa
  • Special Issue
  • - Volume 8
  • - Article ID 451269

Photochemical Image Formation Process for High Density Printed Circuit Patterns

Katsuhiro Takahashi | Kunihiro Ikari | ... | Takahiro Tsunoda
  • Special Issue
  • - Volume 8
  • - Article ID 680573

Multi-Layer 2 Mil Line Technology

Tamio Saito | Yoshikatsu Fukumoto
  • Special Issue
  • - Volume 8
  • - Article ID 783076

Development of Substrate Carrier System

N. Miura | Y. Fuura | K. Uchida
  • Special Issue
  • - Volume 8
  • - Article ID 290815

Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads

M. Nitta | T. Tsuge | ... | R. Kato
  • Special Issue
  • - Volume 8
  • - Article ID 308023

Thick Film Circuits for Telecommunications Equipment

William B. Grupen | Howard M. Cohen
  • Special Issue
  • - Volume 8
  • - Article ID 372616

Fabrication of Nonreciprocal Microwave Components Using Thick Film Ferrimagnetic Pastes

Chinmay. K. Maiti | D. Bhattacharyya | N. B. Chakrabarti
  • Special Issue
  • - Volume 8
  • - Article ID 720154

A New Type of Film Driver

Masato Murata | Shohei Akitake | ... | Shiro Otani
  • Special Issue
  • - Volume 8
  • - Article ID 615687

Conference Diary

Active and Passive Electronic Components
 Journal metrics
Acceptance rate14%
Submission to final decision54 days
Acceptance to publication35 days
CiteScore1.100
Impact Factor-
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