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ElectroComponent Science and Technology
Volume 8, Issue 1-2, Pages 15-19

Tape Automated Bonding for High Density Packaging

CII-Honeywell Bull, Rue Jean Jaurès, Les Clayes-sous-Bois 78 340, France

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Karel Kurzweil, “Tape Automated Bonding for High Density Packaging,” ElectroComponent Science and Technology, vol. 8, no. 1-2, pp. 15-19, 1981.