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ElectroComponent Science and Technology
Volume 8, Issue 1-2, Pages 99-102

Photochemical Image Formation Process for High Density Printed Circuit Patterns

1Toshiba Research and Development Center, Kanagawa 210, Japan
2Faculty of Engineering, Chiba University, Chiba 280, Japan

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


A new method for fabricating high density printed circuit boards has been investigated. The procedure used for photoselective metal deposition on the substrate consists of five steps: adhesion treatment, sensitization, nucleation, fog inhibition and electroless metal deposition. An adhesive coated substrate was sensitized by introducing an aqueous solution containig anthraquinone sulfonic acid sodium salts, reducible noble metal salts and alcohol. The sensitized substrate was then exposed through a mask to a u.v. light. The noble metal nuclei produced by exposure were developed by electroless copper deposition after rinsing with aqueous solutions containing complex agents. Electrically-conductive patterns thus obtained can be further intensified by second electroless plate making.