Active and Passive Electronic Components

Active and Passive Electronic Components / 1981 / Article
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International Microelectronics Conference. Part II

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Volume 8 |Article ID 546016 | https://doi.org/10.1155/APEC.8.235

Takashi Tamura, Akihiro Dohya, Tatsuo Inoue, "Combination of Thick-Film Dielectric/Thin Film Conductor for Fine Pattern Formation of Multi-Layer Substrate", Active and Passive Electronic Components, vol. 8, Article ID 546016, 5 pages, 1981. https://doi.org/10.1155/APEC.8.235

Combination of Thick-Film Dielectric/Thin Film Conductor for Fine Pattern Formation of Multi-Layer Substrate

Abstract

Presented in this paper is a realization of Multi-Layer Substrate with 30 μm signal pattern width and 100 μm square via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP” process, has been applied on a thick film dielectric layer. For the 100 μm square via holes through the thick film dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This paper describes the processes and the results obtained by the method.

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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