The causes of failure mechanisms of multilayer ceramic capacitors that result in zero resistance (shorts) or low
resistance (high leakage) behaviour in the capacitors when the capacitors are subjected to low voltages have been
studied. It has been found that failures resulted from the electrochemical reaction of electrode materials in the
microscopic open pores which pass across a ceramic layer between inner electrodes and are filled with water
containing Cl&#8722; ions. The mechanism found in this investigation has been applied to enable screening processes to be
evolved for manufactured capacitors to eliminate the possibility of failure and hence to improve the reliability of
circuits using multilayer ceramic capacitors.

Hirofumi  Ikeo

Sanpei  Sakamoto

Ken  Sato

Hisakazu  Nishiura

Katsuhiro  Ohno

Failure Mechanisms That Cause High Electrical Leakage in Multilayer
Ceramic Capacitors

Polyimide resin of solvent-soluble type, which is called “X-resin” in short, was discovered lately. It is soluble in
dimethylacetoamid (DMAc), and new extensive applications are expected.Some physical, chemical and electrical characteristics are studied from the viewpoint of polymer material for hybrid
application. Particularly comparison of the characteristics of X-resin specimens before and after long term exposure
to humid and hot environments were made, remembering that electronic devices often operate under such conditions
in Japan.From the results obtained up to now, no conspicuous difference seems to exist between the characteristics of X-resin
and those of the conventional (i.e., solvent-insoluble) resins, as published in various literature. It should be noted,
however, that some unusual effects, i.e., the remarkable increase in surface resistivity σ, the evident decrease in tan <mml:math id="E1" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>δ</mml:mi></mml:math>,
etc., were found in X-resin specimens after going through the above-mentioned damp-hot test. All those effects are
contrary to the usual concepts of deterioration of polymer materials, but are rather advantageous for hybrid
application. It is also worth noticing that silver migration into X-resin seems scarcely to occur.Furthermore, new prospective uses of X-resin for printed wiring boards, packaging materials, binder for paste
materials, etc., are investigated.

Eiki Watanabe

Kyoichi Kanou

Tadashi Kubota

Fundamental Characteristics of Solvent–Soluble Polyimide Resin as a
Polymer for Hybrid Applications

K.  Kawabata

T.  Muto

Electrical Properties of Titanium Nitride Thin Films Deposited by Reactive Sputtering

Many recommendations have been made on the proper operating conditions for the laser trimming process. In
general these recommendations have centered on accuracy, precision or throughput. In some instances, these have
appeared to be mutually exclusive. If one wanted accuracy and precision, one had to sacrifice trimming speed and,
therefore, throughput.It has been reported that 40&#37; of the processing cost of a thick film resistor network is due to laser trimming. To
continue to make these networks commercially attractive, the manufacturers of laser trimming systems have addressed
themselves to the problem of providing suitable cuts at higher and higher trimming speeds.It is important for the user of such a system to understand the basics of the trimming process and to have an
appreciation for the new factors which will affect the performance characteristics of laser trimmed thick film resistors.
This paper summarizes the previous work as it relates to present technology. It then attempts to develop new
guidelines for high speed laser trimming.

Ren&#233; E. Cot&#233;

The Effect of High Speed Laser Trimming on Accuracy and Stability
of Thick Film Resistors

IC-Quartz watches have been manufactured since the appearance of CMOS-LSI about seven years ago. Nowadays,
the outside view of the quartz watch is the same as that of a mechanical watch through minimizing electronic parts such
as battery, crystal oscillator, capacitor, and IC packaging volume. Recently, IC packaging technology for electronic
wrist watches (both the analog quartz watch and digital quartz watch) has made a step foward. In Japan, some watch
makers adopt a film carrier assembly technique for producing thin and low-priced watches. They are using 3 layers and
35 mm wide film which fits very well the substrate of the quartz watch, especially the digital quartz watch.The Citizen Watch Co., Ltd. started an investigation as to which method was suitable for IC package for watches in
1975 and adopted a flip chip technique as being the most suitable for analog quartz watches. The flip chip technique
will allow the fabrication of a very small and thin package. Important characteristics of the technique permit design
flexibility and high density packaging of the ICs. In this paper, a flip chip technique using a Printed Circuit Board as a
substrate is described.

Yoshio  Iinuma

IC Packaging Technology for Electronic Watches

A newly developed AVI transponder is to be used in Automatic Vehicle Identification (AVI) system, which provides
identification of moving vehicles passing by a certain location, as to its registration number, and classification etc. This
AVI system is characterized by the fact that it utilizes ceramic resonators in the composition of a transponder
identification code, and a single microwave carrier to convey an interrogation signal to, and a response signal from,
that transponder.The transponder is a completely passive device free of any power supply, and operates as a &#8220;Reflector&#8221;. Overall
external dimensions of transponder are 7 &#215; 10  &#215; 1 cm with a weight of 150 grams, the unit is compact, light weight
and can be mounted easily on the vehicle, and is easy to carry.All of the circuitry required for the transponder is provided in the form of microstrip lines utilizing MIC (Microwave
Integrated Circuit) technology on the PTFE-glass fibre laminate substrate. The transponder circuitry, which consists
of printed antenna, microwave modem circuit and medium frequency circuit, is patterned on both surfaces of the single
substrate. In this paper, operation principle, circuitry and construction of the transponder will be described.

Shoichi  Kamata

Yoshinori  Kimura

Johji  Sakuragi

AVI Transponder

In hybrid integrated circuit mask design, the design quality largely depends on the designer&#39;s experience and
creativity. It is difficult to completely automate the design process as is done with LSIs or printed circuit boards. It is
important to incorporate flexibility into the system.This paper describes an interactive design system for laying out hybrid ICs. The system is implemented on a large
host computer, and graphic display terminals are connected to it in a time sharing environment. The system provides
designers with many interactive facilities which are useful in designing hybrid ICs. In addition to highly interactive
dialogue, the system has capabilities such as dynamic checking of the designer&#39;s operations against a set of design
rules, or automatic generation of standardized element patterns.The system outputs mask information, design documents and so on which are used in the CAM of hybrid ICs. The
system is being used at Fujitsu and is contributing to high reliability of the design, and shortening the design period.

Hiroshi  Shiraishi

Kaoru  Kawamura

Masaaki  Hayashi

An Interactive Design System for Hybrid ICs

W.  Kinsner

A Theory of Bubbles in Ion-implanted Structures

An electron beam was used to create thin polysiloxane films from methylphenylsiloxane and the anomalous properties
of permittivity and temperature dependence, the resistivity dependence on humidity and the permittivity dependence
on pressure of air or argon, was examined. These anomalous properties can be potentially applicable to humidity
probes, pressure gauges and for miniature capacitors.

Vladim&#237;r  Ry&#353;anek

The Anomalous Properties of Polysiloxane Films

B. S. Joll

A Stand-Alone Magnetic Bubble Memory

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Active and Passive Electronic Components

International Microelectronics Conference. Part II

International Microelectronics Conference. Part II

Articles

Failure Mechanisms That Cause High Electrical Leakage in Multilayer Ceramic Capacitors

Fundamental Characteristics of Solvent–Soluble Polyimide Resin as a Polymer for Hybrid Applications