Carl R. Zimmer, "Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects", Active and Passive Electronic Components, vol. 10, Article ID 171947, 6 pages, 1983. https://doi.org/10.1155/APEC.10.171
Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects
This paper describes the application of a modern general purpose network analysis programme SPICE2 for the electrothermal analysis of hybrid integrated circuits. Self thermal coupling effects are modelled using the non-linear dependent current and voltage source capability in this programme, together with thermal environment parameters obtained from a three-dimensional thermal analysis program. Although numerical results are given by a bipolar transistor, the method is also applicable to monolithic integrated circuits and to resistors with variable temperature coefficients as power dissipating elements.
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