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ElectroComponent Science and Technology
Volume 10 (1983), Issue 2-3, Pages 177-183
http://dx.doi.org/10.1155/APEC.10.177

Enamelled Steel Substrates for Printed Circuits

R. Kužel1,2 and J. Broukal1,2

1Faculty of Mathematics and Physics, Charles University, Ke Karlovu 5, Prague 2 121 16, Czech Republic
2State Glass Research Institute, Hradec Králové I 501 92, Czech Republic

Received 11 November 1981; Accepted 11 November 1981

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The preparation of steel substrates coated with intermediate ground and final ceramic coatings is described. The basic material for the preparation of both coatings is the same kind of special glass. The coatings were thermally treated up to 960℃. The resulting substrates were tested for the usage in thick film technology by applying ruthenium resistor compositions designed for use on ceramic substrates. The resistors were fired up to 900℃ and their resistance and TCR were measured. They showed almost the same dependence on firing temperature as the resistors printed on alumina substrates. The TCR was only shifted towards more positive values.