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ElectroComponent Science and Technology
Volume 10, Issue 4, Pages 209-216
http://dx.doi.org/10.1155/APEC.10.209

Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits

Hasler AG, Bern, Switzerland

Received 5 June 1981; Accepted 26 June 1982

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Ch. Zimmer, “Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits,” ElectroComponent Science and Technology, vol. 10, no. 4, pp. 209-216, 1983. https://doi.org/10.1155/APEC.10.209.