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ElectroComponent Science and Technology
Volume 10, Issue 4, Pages 317-321

Description and Performance of a Novel Concept “Single Level” Ceramic Chip Carrier

Sprague Electromag Belgium, N. V. Merodestraat, Ronse 2B-900, Belgium

Received 5 November 1981; Accepted 13 August 1982

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Two different designs of ceramic chip carriers are discussed. A carrier capable of being hermetically sealed has been developed which uses a glass seal combined with an epoxy bonded chip. A second carrier which does not have hermeticity has also been designed in which the alumina cap is attached to the base with a thermo setting resin. The applicability of these two types is examined.