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ElectroComponent Science and Technology
Volume 10, Issue 2-3, Pages 111-127

Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism

1Thomson-CSF. CIMSA, 10-12 av. de l' Europe, Velizy 78140, France
2EFCIS, av. de l' Europe, Velizy 78140, France

Received 1 October 1981; Accepted 11 November 1981

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


In this paper, the metallurgical aspect of conductor/solder/metallisation are analysed after cycling and ageing and the mechanism of degradation of the micro-solder is considered. As a consequence a new solder process of reflow is analysed (vapor phase reflow).