Active and Passive Electronic Components

Active and Passive Electronic Components / 1983 / Article

Open Access

Volume 11 |Article ID 874910 | 7 pages |

A Short Communication — Determination of Chip and Substrate Temperatures

Accepted10 Jun 1982


Through making use of the analogy between electrical current and thermal heat flow, thermal calculations for thick film substrates may be undertaken using standard computer aided design programs such as SPICE 2. Chip temperature and substrate isotherms for various conditions can readily be determined. Parameters considered in this paper are chip position on substrate, with and without heat sink, number of chips on a substrate and substrate materials.

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

68 Views | 464 Downloads | 2 Citations
 PDF  Download Citation  Citation
 Order printed copiesOrder

We are committed to sharing findings related to COVID-19 as quickly and safely as possible. Any author submitting a COVID-19 paper should notify us at to ensure their research is fast-tracked and made available on a preprint server as soon as possible. We will be providing unlimited waivers of publication charges for accepted articles related to COVID-19. Sign up here as a reviewer to help fast-track new submissions.