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ElectroComponent Science and Technology
Volume 11, Issue 1, Pages 71-84
http://dx.doi.org/10.1155/APEC.11.71

Reliability Assessment and Screening by Reliability Indicator Methods

The Engineering Academy of Denmark, Building 451, Lyngby DK-2800, Denmark

Received 20 October 1982; Accepted 28 January 1983

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Built-in flaws in electronic components have been recognized as a serious cause of failure. They are difficult to screen away by conventional methods because the times-to-failures for component working in systems are often rather long and because accelerated burn-in may screen by the wrong failure mechanisms. As an alternative, the concept and possible use of reliability indicator methods are discussed and some recently developed methods described.