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ElectroComponent Science and Technology
Volume 11, Issue 2, Pages 117-122

Wire Laying Methods as an Alternative to Multilayer PCB's

1PCK Technology, Melville, New York, USA
2Fuba, Gittelde, Germany

Received 20 October 1982; Accepted 16 November 1982

Copyright © 1984 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

G. Messner, P. Plonski, and A. Martens, “Wire Laying Methods as an Alternative to Multilayer PCB's,” ElectroComponent Science and Technology, vol. 11, no. 2, pp. 117-122, 1984.