Research Article

Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

Table 1

Via parasitics associated with different CNT bundled TSVs.

Via parasiticsSWCNT bundleDWCNT bundleMWCNT bundle
Shell = 4Shell = 8Shell = 10

54003825233613521148
(k )3.20243.20133.20073.20043.2003
( / m)1.191.251.361.371.38
(pH/ m)2.994.236.9311.9714.09
(fF/ m)521.53369.45225.61130.58110.89
(fF/ m)76.4829.6910.173.262.23
(fF/ m)7.715.073.171.931.64