Research Article
Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via
Table 3
Percentage reduction of out-phase delay for 10-shell MWCNT bundled TSV w.r.t. SWCNT, DWCNT, and 4-shell and 8-shell MWCNT bundle based TSVs.
| TSV heights (m) | % reduction in delay for MWCNT bundle (shell = 10) in comparison to | SWB | DWB | MWB (shell = 4) | MWB (shell = 8) |
| 50 | 78.14 | 60.86 | 35.98 | 10.19 | 100 | 85.27 | 70.12 | 44.12 | 10.55 | 150 | 88.61 | 75.69 | 49.89 | 13.49 | 200 | 90.37 | 78.84 | 53.67 | 15.99 |
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