Active and Passive Electronic Components

The First European Hybrid Microelectronics Conference. Part I


Status
Published

The First European Hybrid Microelectronics Conference. Part I

Articles

  • Special Issue
  • - Volume 4
  • - Article ID 347378

Techniques for the Examination of Thick Film Resistor Microstructures by T.E.M.

D. J. Pedder
  • Special Issue
  • - Volume 4
  • - Article ID 232686

A High Voltage, High Performance Thick Film Resistor System

Sidney J. Stein | Cornelius Huang | Allan S. Gelb
  • Special Issue
  • - Volume 4
  • - Article ID 156109

Conduction Processes in High Value Thick Film Resistors

J. Robertson
  • Special Issue
  • - Volume 4
  • - Article ID 392910

Development and Production of Hybrid Circuits for Microwave Radio Links

Per Chr. Malmin
  • Special Issue
  • - Volume 4
  • - Article ID 286151

Ageing Tests on Gold Layers and Bonded Contacts

H. Hieber | F. Betke | K. Pape
  • Special Issue
  • - Volume 4
  • - Article ID 128709

Resistor Geometry Comparison With Respect to Current Noise and Trim Sensitivity

W. Ulbrich
  • Special Issue
  • - Volume 4
  • - Article ID 517910

Editorial

D. S. Campbell
  • Special Issue
  • - Volume 4
  • - Article ID 843279

Conference News

  • Special Issue
  • - Volume 4
  • - Article ID 495210

Hybrid-Integrated Series-to-Parallel Converters for Gigabit Rates

G. Hanke
  • Special Issue
  • - Volume 4
  • - Article ID 169594

Biotelemetry and Radiotracking of Wild Birds: Portable Device Using Solar Cells Power Supply

J. L. Aucouturier | A. Chaillou | ... | M. Marques
Active and Passive Electronic Components
 Journal metrics
Acceptance rate14%
Submission to final decision54 days
Acceptance to publication35 days
CiteScore1.100
Impact Factor-
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