A Method for Run-Time Prediction of On-Chip Thermal Conditions in Dynamically Reconfigurable SOPCs

Table 3

Relation between STPC and TPC observed at 3 minutes for Zynq.

	Frequency	(mW)	(mW)	(mW)
Design 1	30	3672	3732	60
	60	3780	3840	60
	90	3912	3972	60
	120	4020	4080	60
	150	4116	4176	60
	180	4212	4272	60
Design 2	30	3696	3756	60
	60	3876	3936	60
	90	3984	4056	72
	120	4128	4188	60
	150	4260	4320	60
	180	4356	4428	72
Design 3	30	3720	3780	60
	60	3936	3996	60
	90	4080	4140	60
	120	4236	4296	60
	150	4368	4440	72
	180	4524	4584	60
Design 4	30	3732	3816	84
	60	3972	4056	84
	90	4152	4212	60
	120	4344	4404	60
	150	4500	4572	72
	180	4668	4752	84
Design 5	30	3780	3852	72
	60	3996	4056	60
	90	4224	4284	60
	120	4428	4512	84
	150	4656	4728	72
	180	4872	4956	84