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Journal of Nanomaterials
Volume 2015 (2015), Article ID 897142, 7 pages
Research Article

Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

1School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, China
2School of Mechanical, Electronic, and Industrial Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
3Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, ON, Canada N2L 3G1

Received 22 January 2015; Revised 12 May 2015; Accepted 18 May 2015

Academic Editor: Changhong Ke

Copyright © 2015 Wei Guo et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Ag nanoparticles (NPs) with about 40 nm diameter covered with 5–8 nm organic shell were prepared by chemical reduction reaction. The thermal characteristics of Ag nanoparticle (NP) paste were measured by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The low-temperature sintering bonding processes using Ag NP paste were carried out at the temperature range of 150–350°C for 5 min under the pressure of 3 MPa. The microstructures of the sintered joint and the fracture morphology were evaluated by scanning electron microscopy (SEM). The shear strength was used to evaluate the mechanical property of the sintered joint. TGA-DSC test showed that the Ag content is approximately 95.5 mass% in Ag NP paste. The average shear strength of the joint fabricated at 250°C for 5 min under the pressure of 3 MPa was about 28 MPa, which could meet the requirements of electronics packaging working at high temperature. The joint shear strength increased with the increase of the sintering temperature due to much denser sintered Ag NPs and more comprehensive metallurgical bonds formed in the joint.