Journal of Sensors / 2014 / Article / Tab 1

Research Article

Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill

Table 1

Material parameters.

MaterialsElastic modulus
/MPa
Poisson’s ratio
µ
CTE
α/(×10−6/K)

Si ROIC1630000.28See Figure 1(b)
InSb chip4090000.35See Figure 1(b)
Indium bump106000.45See Figure 1(b)
UnderfillSee (2)0.3See Figure 1(a)