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Electromagnetic Techniques for Vibration Damping and Isolation

Call for Papers

Electromagnetic devices for vibration damping and isolation are becoming a real alternative to traditional mechanical vibration and isolation methods. The performance of new magnetic materials in combination with optimization tools allows the development of efficient and tunable vibration damping and/or isolation techniques. Moreover, damping and isolation by electromagnetic means can be clean and environmentally friendly since there is no need of using fluids; thus they can be applied in clean, harsh, and/or extreme temperature environments such as space, aerospace, electric vehicles, and microfabrication industries. Nevertheless, there are still critical issues to be solved like optimization of masses, performance, and cost, ageing of the devices, reduction of external electromagnetic interferences, or frequency tuning.

The aim of this special issue is to collect research articles on electromagnetic devices for vibration damping and isolation in civil and mechanical engineering applications. Articles describing original theoretical research as well as new experimental results are welcome. The research must be product-oriented; i.e., it must consider the requirements of a particular application and demonstrate significant, unique, or economically differential factors in respect to other techniques for a particular application.

Potential topics include but are not limited to the following:

  • Eddy current vibration damping
  • Magnetic hysteresis vibration damping
  • Magnetorheological damping (only if electromagnetic effects are analyzed)
  • Magnetic levitation vibration isolation
  • Magnetic negative stiffness damping
  • Electromagnetic tuned mass absorbers
  • Microelectromechanical devices for microvibration damping (MEMS)

Authors can submit their manuscripts through the Manuscript Tracking System at https://mts.hindawi.com/submit/journals/sv/ntvd/.

Submission DeadlineFriday, 19 April 2019
Publication DateSeptember 2019

Papers are published upon acceptance, regardless of the Special Issue publication date.

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