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VLSI Design
Volume 13 (2001), Issue 1-4, Pages 363-367
http://dx.doi.org/10.1155/2001/38657

A Percolative Approach to Reliability of Thin Film Interconnects and Ultra-thin Dielectrics

1Dipartimento di Ingegneria dell' Innovazione and INFM, Università di Lecce, Via Arnesano s/n, Lecce 73100, Italy
2Dipartimento di Scienza dei Materiali, Università di Lecce, Via Arnesano s/n, Lecce 73100, Italy

Copyright © 2001 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

C. Pennetta, L. Reggiani, Gy. Trefán, R. Cataldo, and G. De Nunzio, “A Percolative Approach to Reliability of Thin Film Interconnects and Ultra-thin Dielectrics,” VLSI Design, vol. 13, no. 1-4, pp. 363-367, 2001. doi:10.1155/2001/38657