Research Article

Microsegregation and Solidification Shrinkage of Copper-Lead Base Alloys

Table 4

Calculated liquid composition during the solidification of the Cu-5Sn-5Pb alloy.

Temperature (K)Solid Fraction (wt.%) (wt.%)

129305.244.76
12880.2056.065.99
12780.3646.987.48
12580.5258.3910.02
12230.64810.1413.25
11730.75812.8519.67