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Advances in Materials Science and Engineering
Volume 2013 (2013), Article ID 825195, 7 pages
Research Article

Comparison of H2 and NH3 Treatments for Copper Interconnects

1Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30013, Taiwan
2Department of Electrical Engineering, National Chi Nan University, Nantou 54561, Taiwan

Received 2 September 2013; Accepted 20 November 2013

Academic Editor: Chun-Hsing Shih

Copyright © 2013 Yu-Min Chang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Yu-Min Chang, Jihperng Leu, Bing-Hong Lin, Ying-Lung Wang, and Yi-Lung Cheng, “Comparison of H2 and NH3 Treatments for Copper Interconnects,” Advances in Materials Science and Engineering, vol. 2013, Article ID 825195, 7 pages, 2013. doi:10.1155/2013/825195