Advances in Materials Science and Engineering

Thin Film Applications in Advanced Electron Devices


Publishing date
21 Feb 2014
Status
Published
Submission deadline
04 Oct 2013

Lead Editor

1Department of Electronic Engineering, Ming Chuan University, Taoyuan, Taiwan

2Department of Electronic Engineering, Chang Gung University, Taoyuan, Taiwan

3Department of Physics, Visva-Bharati University, West Bengal, Santiniketan 731235, India

4Department of Electrical Engineering, National Chi Nan University, Nantou, Taiwan


Thin Film Applications in Advanced Electron Devices

Description

The theme of this special issue is focused on thin film applications in advanced electron devices. The field of thin films, which can be defined as the confluence of materials science, surface science, chemistry, and applied physics, has become an identifiable unified discipline of scientific endeavor.

Authors are invited to submit original research articles as well as review articles to this special issue. Potential topics include, but are not limited to:

  • Fundamentals of thin films and devices:
    • Nanomaterials and nanostructured thin films
    • Electronic structures and defects
    • Thermal and mechanical properties
    • Advanced synthesis and growth techniques
    • Advanced fabrication technologies
    • Thin film characterization and reliability
    • Device characterization techniques
    • Device reliability
    • Modeling and simulation: device or process materials science and device physics
  • Thin film applications in:
    • Novel functional devices
    • Nonvolatile memories
    • Optoelectronic devices
    • Advanced transistors
    • Sensors and actuators
    • Biology and medicine
    • Organic materials-based devices
    • Magnetics and magnetooptics
    • Superconductors

Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/amse/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/amse/tfa/ according to the following timetable:


Articles

  • Special Issue
  • - Volume 2014
  • - Article ID 927358
  • - Editorial

Thin Film Applications in Advanced Electron Devices

Fu-Chien Chiu | Tung-Ming Pan | ... | Chun-Hsing Shih
  • Special Issue
  • - Volume 2014
  • - Article ID 878064
  • - Research Article

Percolation of Carbon Nanoparticles in Poly(3-Hexylthiophene) Enhancing Carrier Mobility in Organic Thin Film Transistors

Chang-Hung Lee | Chun-Hao Hsu | ... | Chih-Ting Lin
  • Special Issue
  • - Volume 2014
  • - Article ID 578168
  • - Review Article

A Review on Conduction Mechanisms in Dielectric Films

Fu-Chien Chiu
  • Special Issue
  • - Volume 2014
  • - Article ID 594516
  • - Research Article

Room-Temperature Voltage Stressing Effects on Resistive Switching of Conductive-Bridging RAM Cells with Cu-Doped SiO2 Films

Jian-Yang Lin | Bing-Xun Wang
  • Special Issue
  • - Volume 2014
  • - Article ID 425085
  • - Research Article

Bipolar Switching Characteristics of RRAM Cells with CaBi4Ti4O15 Film

Jian-Yang Lin | Chia-Lin Wu
  • Special Issue
  • - Volume 2013
  • - Article ID 825195
  • - Research Article

Comparison of H2 and NH3 Treatments for Copper Interconnects

Yu-Min Chang | Jihperng Leu | ... | Yi-Lung Cheng
  • Special Issue
  • - Volume 2013
  • - Article ID 692469
  • - Research Article

Effect of Coercive Voltage and Charge Injection on Performance of a Ferroelectric-Gate Thin-Film Transistor

P. T. Tue | T. Miyasako | ... | T. Shimoda
  • Special Issue
  • - Volume 2013
  • - Article ID 857465
  • - Research Article

Electric and Magnetic Properties of Sputter Deposited BiFeO3 Films

N. Siadou | I. Panagiotopoulos | ... | A. Lappas
  • Special Issue
  • - Volume 2013
  • - Article ID 950439
  • - Research Article

Surface State Capture Cross-Section at the Interface between Silicon and Hafnium Oxide

Fu-Chien Chiu
  • Special Issue
  • - Volume 2013
  • - Article ID 971790
  • - Research Article

Comparison of Microstructural and Morphological Properties of Electrodeposited Fe-Cu Thin Films with Low and High Fe : Cu Ratio

Umut Sarac | M. Celalettin Baykul
Advances in Materials Science and Engineering
 Journal metrics
Acceptance rate33%
Submission to final decision71 days
Acceptance to publication29 days
CiteScore2.300
Journal Citation Indicator0.240
Impact Factor1.726
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