(a)
(b)
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Figure 6: General morphology of semispherical melted chips formed after internal cylindrical grinding (carried out in various kinematic variations) of 100Cr6 steel obtained by use of scanning electron microscope JSM-550LV produced by JEOL: (a) SEM micrograph (size: 543.20 × 403.08 μm, mag. 200×) of GWAS 1–35 × 20 × 10-SG/F46K7VTO after internal cylindrical traverse grinding of 100Cr6 steel, showing two forms of spherical melted chips which formed and bonded with dulled abrasive grain vortex, (b) AOI (size: 170.37 × 12.30 μm, mag. 500×) extracted from (a), (c) SEM micrograph (size: 2514.28 × 1917.14 μm, mag. 500×) of the GWAS 1–35 × 20 × 10-SG/F46K7VTO after internal cylindrical plunge grinding of 100Cr6 steel, showing concentration of random-kind chips in free intergranular space between SG abrasive grains, (d) AOI (size: 222.85 × 165.71 μm, mag. 1000×) extracted from (c), (e) SEM micrograph (size: 258.82 × 194.41 μm, mag. 500×) of the GWAS 1–35 × 20 × 10-SG/F46K7VTO after internal cylindrical plunge grinding of 100Cr6 steel, showing various sizes of single semispherical melted chips on SG abrasive grain, and (f) AOI (size: 53.52 × 39.70 μm, mag. 2000×) extracted from (e). Note: Acc. voltage, accelerating voltage; BES, backscattered electron (shadow image); WD, working distance.