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| Material | Type | Composition | Description |
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| Etching gel (Heraeus Kulzer) | 37% phosphoric acid | 37% orthophosphoric acid, inorganic silica gel thickener | Etching gel |
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| Gluma self-etch (Heraeus Kulzer) | Self-etch | HEMA, acetone, maleic acid, TEGDMA, UDMA, HEMA, Bis-GMA, filler, and photoinitiator | All-in-one bonding agent etches, primes, bonds, and desensitizes in one single step |
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| G-ænial Bond | Self-etch | Acetone, dimethacrylate, phosphoric acid ester monomer, dimethacrylate component, and photoinitiator | HEMA free, one-step, self-etch 7th generation bonding agent |
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| Venus Bulk Fill (Heraeus Kulzer) | Flowable bulk-fill composite | UDMA, EBADMA, fluoroaluminosilicate glass, YbF, and SiO | Permits easy filling of cavities in increments of up to 4 mm |
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| G-ænial Posterior (GC) | Light-cured hybrid composite | UDMA, dimethacrylate comonomers, fluoroaluminosilicate glass, and fumed silica | Allows the light-curing of layers up 2.5–3 mm |
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