The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films

<div>CuMn film TEM micrographs annealed at 350°C: (a) cross-section bright field, (b) selected-area electron diffraction at position A, (c) selected-area electron diffraction at position B, and (d) HRTEM micrographs at position B.</div>

Advances in Materials Science and Engineering

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Figure 2

Figure 2: The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films 