The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films

Figure 3

CuMn film TEM micrographs with 8.7 at.% Y addition annealed at 300°C: (a) cross-section bright field, (b) selected-area electron diffraction, (c) SAD analysis, and (d) HRTEM micrographs.

(a)

(b)

(c)