Cosimulation of Power and Temperature Models at the SystemC/TLM for a Soft-Core Processor

<div>The power consumed for the CPU, bus, and VGA controller at the SystemC/TLM for 65 nm technology node.</div>

Advances in Materials Science and Engineering

Figure 3: Cosimulation of Power and Temperature Models at the SystemC/TLM for a Soft-Core Processor 