Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

<div>Top views and cross-sectional SEM images of the fracture surfaces of eutectic Au-Sn/Ni joints aged under various conditions [<a href="/journals/amse/2020/4969647/#B41">41</a>].</div>

Advances in Materials Science and Engineering

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Figure 3: Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem 