Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Table 1

Shear strength of Au-28Ge solder joints on different substrates [50].

Solder	Substrate	Mean value (MPa)	Standard deviation (MPa)	Min value (MPa)	Max value (MPa)
Au-28Ge	Cu-Ni	121	11	109	142
	Cu-Ti	68	24	29	48
	Ni-Ti	38	8	23	48