Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Table 3

Shear strength of Au-Si eutectic alloys with Cu/Au and ENIG UBM before and after thermal aging at 300°C for various durations [47].

Solder joint	Aging time (h)	Shear strength at RT (g·mil^−2)	Shear strength at 250°C (g·mil^−2)
Au-Si/Au/Cu	0	6.5	5.2
	100	4.7	3.3
	300	2.2	1.7
	500	1.8	1.3
Au-Si/ENIG	0	6.9	5.9
	100	6	5
	300	5.8	4.6
	500	5	4