Review Article
Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem
Table 4
Au-Ag-based medium-temperature solders [
70].
| Alloy | Composition (at.%) | Solidus (°C) | Liquidus (°C) | ΔT (°C) | Au | Ag | Si | Ge |
| Au-Ag-Si | 86.72 | 10.02 | 3.26 | — | 409 | 450 | 41 | 86.63 | 10.12 | 3.25 | — | 411 | 451 | 40 | 82.70 | 14.02 | 3.28 | — | 421 | 457 | 36 | 78.25 | 18.47 | 3.27 | — | 448 | 499 | 51 | 78.30 | 18.50 | 3.20 | — | 449 | 478 | 29 | 78.22 | 18.55 | 3.13 | — | 448 | 481 | 33 |
| Au-Ag-Ge | 58.5 | 19.5 | — | 22.0 | 410 | 449.8 | 39.8 | 60.0 | 15.0 | — | 25.0 | 401.1 | 441 | 39.9 | 67.95 | 19.25 | — | 12.80 | 446.76 | 494.4 | 47.64 | 77.32 | 12.62 | — | 10.06 | 405 | 431 | 26 |
| Au-Ag-Si-Ge | 74.9 | 20.1 | 2.5 | 2.5 | 451.36 | 506.49 | 55.13 |
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