Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

<div>Plot of electrical resistivity of pure Cu and different lead-free and SnPb solder joints created using CSES and CSI methods (before and after corrosion).</div>

Advances in Materials Science and Engineering

fig11

Figure 11

Figure 11: Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 

Figure 11 | Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 