Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

<div>Representative SEM micrographs and EDS results at solder joints of different lead-free and SnPb solder joints created using CSES and CSI methods (before and after corrosion). Element wt.% values are at intermetallic compounds (IMCs).</div>

Advances in Materials Science and Engineering

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Figure 13

Figure 13: Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 

Figure 13 | Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 