Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

<div>Representative SEM micrographs showing microstructure and EDS results at solder portion of different lead-free and SnPb solder joints created using CSES and CSI methods (before and after corrosion). Element wt.% values are at solder portion of solder joints.</div>

Advances in Materials Science and Engineering

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Figure 15

Figure 15: Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 

Figure 15 | Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 