Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

<div>Plot of tensile strength of different lead-free and SnPb solder joints achieved with the CSES technique and CSI method (before and after corrosion).</div>

Advances in Materials Science and Engineering

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Figure 7

Figure 7: Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 

Figure 7 | Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method 