Advances in Materials Science and Engineering

Microstructural Evolution in Materials during Thermal Processing


Publishing date
01 Sep 2011
Status
Published
Submission deadline
01 Mar 2011

Lead Editor

1Department of Physics and Materials Science, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong

2Faculty of Technology and Information Systems, Brunel University, Uxbridge, Middlesex UB8 3PH, UK

3School of Environmental and Chemical Engineering, Shanghai University, Shangda Road 99, Mail Box 144, Shanghai 200444, China

4Department of Electromechanical Engineering, Faculty of Science and technology, University of Macau, Macau, China


Microstructural Evolution in Materials during Thermal Processing

Description

The study of materials science is mainly based on our understanding of the relationship between microstructure and materials properties. Factors such as temperature, stress, and environment can lead to microstructural evolution with a concomitant change in properties. It is the materials scientist's role to harness our knowledge on this relationship to produce materials with improved properties, or to predict the performance of existing materials under various service conditions.

Over the past two decades there have been a burgeoning number of novel or improved materials. This development is accompanied by significant advances in techniques in materials characterization as well as increased sophistication in theoretical methods for the analysis of microstructures. The application of these new techniques and methodologies to study the microstructural evolution of novel materials offers tremendous opportunities for scientific advancement on many fronts, with the prospect of providing new solutions to problems which have hitherto remained intractable.

We invite investigators to contribute original research or review articles that enhance our knowledge and understanding of microstructural evolution phenomena in various materials: metals, polymers, ceramics, semiconductors and so forth. In this special issue, we intend to focus on microstructural evolution during thermal processing. Potential topics include, but are not limited to:

  • Microstructural evolution in nanostructures such as nanoparticles, nanorods, nanowires, nanotubes and so forth
  • Application of fractal methods to the analysis of microstructural evolution of thin films
  • Defect evolution in Nanocrystalline thin films during thermal processing
  • Phase transformation studies in metals and alloys, including magnetic effects and ordering
  • Formation of intermetallic phases and their associated effects on materials properties

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/amse/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/ according to the following timetable:


Articles

  • Special Issue
  • - Volume 2012
  • - Article ID 302478
  • - Editorial

Microstructural Evolution in Materials during Thermal Processing

Joseph K. L. Lai | Brian Ralph | ... | Kin Ho Lo
  • Special Issue
  • - Volume 2012
  • - Article ID 525428
  • - Research Article

Crystallisation Kinetics of a -Spodumene-Based Glass Ceramic

Oscar Rubem Klegues Montedo | Dachamir Hotza | ... | Peter Greil
  • Special Issue
  • - Volume 2011
  • - Article ID 316513
  • - Review Article

Formation and Device Application of Ge Nanowire Heterostructures via Rapid Thermal Annealing

Jianshi Tang | Chiu-Yen Wang | ... | Kang L. Wang
  • Special Issue
  • - Volume 2011
  • - Article ID 987671
  • - Research Article

Thermal Effect on Structure of Silver in Ion-Exchanged Soda-Lime Glasses and Aluminum-Doped Zinc Oxide Films

Paul W. Wang | Yanfeng Jiang | ... | Huang-Lu Chen
  • Special Issue
  • - Volume 2011
  • - Article ID 430604
  • - Research Article

The Effects of Different Types of Fly Ash on the Compressive Strength Properties of Briquettes

ร–zlem ร‡elik Sola | Murat Yayla | ... | Cengiz Duran AtiลŸ
  • Special Issue
  • - Volume 2011
  • - Article ID 747346
  • - Research Article

Crystallization Behavior and Microstructural Analysis of Strontium Rich ( P b ๐‘ฅ S r ๐Ÿ โˆ’ ๐‘ฅ ) T i O ๐Ÿ‘ Glass Ceramics in Presence of L a ๐Ÿ O ๐Ÿ‘

C. R. Gautam | Devendra Kumar | Om Parkash
  • Special Issue
  • - Volume 2011
  • - Article ID 402376
  • - Research Article

Crystallization Behavior and Microstructural Analysis of Lead-Rich ( ๐ ๐› ๐‘ฅ ๐’ ๐ซ 1 โˆ’ ๐‘ฅ ) T i O ๐Ÿ‘ Glass Ceramics Containing 1 mole % ๐‹ ๐š ๐Ÿ ๐Ž ๐Ÿ‘

C. R. Gautam | Devendra Kumar | Om Parkash
  • Special Issue
  • - Volume 2011
  • - Article ID 768143
  • - Research Article

Powder Characterization and Electrochemical Properties of LiNi0.5Mn1.5O4 Cathode Materials Produced by Large Spray Pyrolysis Using Flame Combustion

Shinsuke Akao | Motofumi Yamada | ... | Takashi Ogihara
  • Special Issue
  • - Volume 2011
  • - Article ID 509457
  • - Research Article

Low-Temperature Strengths and Ductility of Various Tungsten Sheets

Yutaka Hiraoka | Hiroaki Kurishita
  • Special Issue
  • - Volume 2011
  • - Article ID 136127
  • - Research Article

Young's Modulus and Coefficient of Linear Thermal Expansion of ZnO Conductive and Transparent Ultra-Thin Films

Naoki Yamamoto | Hisao Makino | Tetsuya Yamamoto
Advances in Materials Science and Engineering
 Journal metrics
Acceptance rate29%
Submission to final decision85 days
Acceptance to publication41 days
CiteScore1.370
Impact Factor1.399
 Submit

We are committed to sharing findings related to COVID-19 as quickly and safely as possible. Any author submitting a COVID-19 paper should notify us at help@hindawi.com to ensure their research is fast-tracked and made available on a preprint server as soon as possible. We will be providing unlimited waivers of publication charges for accepted articles related to COVID-19.