Editorial Board

• George G. Adams, Northeastern University, USA
• Arvind Agarwal, Florida International University, USA
• Mihai Arghir, Université de Poitiers, France
• Pranesh B. Aswath, University of Texas at Arlington, USA
• Shyam Bahadur, Iowa State University, USA
• Bharath Bhushan, Ohio State University, USA
• Navin Chand, Advanced Materials and Processes Research Institute, India
• Huseyin Çimenoǧlu, Istanbul Technical University, Turkey
• Enrico Ciulli, Università di Pisa, Italy
• João P. Davim, University of Aveiro, Portugal
• Patrick De Baets, Ghent University, Belgium
• Abdallah Elsharkawy, Kuwait University, Kuwait
• Liang Fang, Xi'an Jiaotong University, China
• Kambiz Farhang, Southern Illinois University, USA
• Michel Fillon, University of Poitiers, France
• Klaus Friedrich, University of Kaiserslautern, Germany
• Hiromu Hashimoto, Tokai University, Japan
• Meng Hua, City University of Hong Kong, Hong Kong
• Said Jahanmir, National Institute of Standards and Technology, USA
• GunHee Jang, Hanyang University, Republic of Korea
• Yuansheng Jin, Tsinghua University, China
• Motohiro Kaneta, Kyushu Institute of Technology, Japan
• Yuan Kang, Chung Yuan Christian University, Taiwan
• Ajay Kapoor, Swinburne University, Australia
• Koji Kato, Tohoku University, Japan
• Michael M. Khonsari, Louisiana State University, USA
• Dae-Eun Kim, Yonsei University, Republic of Korea
• Braham Prakash, Luleå University of Technology, Sweden
• Jerzy T. Sawicki, Cleveland State University, USA
• Steven R. Schmid, University of Notre Dame, USA
• Ian Sherrington, University of Central Lancashire, United Kingdom
• Sujeet Kumar Sinha, Indian Institute of Technology, India
• Gwidon Stachowiak, University of Western Australia, Austria
• Andras Z. Szeri, University of Delaware, USA
• Joze Vizintin, University of Ljubljana, Slovenia
• Anna Walicka, University of Zielona Gora, Poland
• Si-Wei Zhang, University of Petroleum, China