About this Journal

Material Design & Processing Communications (MDPC) seeks to spread and promote materials research advancing the understanding and applicability of novel design methodologies, production technologies, failure prediction models technologies, structure-property relationships, characterisation, monitoring and standardization. The journal links these topics featuring multi-disciplinary, multi-scale and multi-material research.

Advances in digital design combined with modern manufacturing capabilities are revolutionizing engineering practice. We are now able to create unprecedented topological features and complex multi-material fabrics all in just a few process steps and directly from a digital data file. Today’s challenge is to understand, utilize and combine these capabilities to create the means for achieving usable, reliable and sustainable next generation structural designs.

MDPC focusses on the combination of modern manufacturing capabilities, structural optimization and property assessment. The aim is to support the development of multiscale modelling, topology optimization, virtual testing and failure prediction with a view to introducing and integrating novel fabrication capabilities into the design space. Applicable research spans multiple disciplines including biology, engineering, physics and chemistry. Research investigating the interaction between disciplines, length scales and multiple and dissimilar materials is the focus of the journal.

This journal is published by Hindawi as part of a publishing collaboration with John Wiley & Sons, Inc. It is a fully open access journal produced under the Hindawi and Wiley brands.

ISSN: 2577-6576 (Online)

DOI: 10.1155/mdp

Archival content

Content published prior to 2022 is hosted on the Wiley Online Library. 

Material Design & Processing Communications is an open access journal. All articles are immediately available to read and reuse upon publication. More information about our Open Access policy can be found on our copyright page.

Editorial enquiries should be directed to [email protected].

General enquiries should be directed to [email protected].