Because of interaction of resistor and conductor material and variation of film thickness due to different resistor
geometries, square resistance becomes a function of resistor length and width. Additional to the square resistance
one paste parameter or two parameters must be introduced if the influence of both length and width on the square
resistance is to be taken into account. From resistance measurements of a test pattern all paste parameters can be
calculated as numerical functions of resistor length by a computer programme using the method of least squares.
Beside the layout of thick film resistors, the data are suitable to give a computer plot of square resistance in relation
to length and width. This representation can play an important part in paste evaluation and process control. It shows
at a glance what relationship will be present with various combinations of conductor and resistor materials or by
changed process conditions.

G.  Stecher

A New Concept in Calculation of Thick Film Resistors

A high speed ECL multiplexing unit which accepts 4 channels of data and control information is described.
Compatibility with commercial circuits to facilitate economic interfacing at low speed data rates is an integral design
criterion. Built from flip-flops and gates made in a 5 GHz
&#102;<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:msub><mml:mn /><mml:mi>T</mml:mi></mml:msub></mml:math> chip technology which includes two-level metallisation
and gold beam leads, the multiplexer is mounted on a ceramic substrate and contained in a standard DIL package.
Dissipating less than 0.75 watt it outputs data faster than 300 Mb/s. Some conclusions concerning the merits of
combining hybrid and monolithic technology are drawn.

J. B. Coughlin

J. B. Hughes

R. S. Watts

F. W. Siegert

A High Speed ECL Multiplexer in Beam Lead, Hybrid Technology

In a method developed for measuring the adhesion of metallic films for hybrid microelectronic circuits, pull rods
soldered or epoxy bonded to metallization pads are pulled off at an angle normal to the substrate. The test circuits
and testing devices are described. Tensile strengths of 40 to 80 N/mm2 and 5 to 30 N/mm2 are typical for thin-film
circuits and thick-film circuits, respectively. The weakest point in the overall circuit configuration is determined.
The information obtained indicates the maximum permissible mechanical loads to which the discrete devices of
microelectronic circuits can be exposed and may also be evaluated for process optimization.

H. G. Kadereit

A.  Schlemm

Adhesion Measurements of Metallizations for Hybrid Microcircuits

Advances in hybrid automatic wire bonding include refined joy stick techniques, automatic alignment, a digitally
operated head for higher speeds and flexibility, missing ball detection and programming aids. Advanced hybrid die
attach equipment will have to accept a large variety of chip presentation techniques but will use CCTV and automatic
alignment with microprocessor controls to aid programming and speed output.

A.  Soffa

Remarks on Wire and Die Bonding for Hybrid Circuits

The electrical characteristics of ruthenium-based thick-film resistors with different conductive terminations (PtAu
and Ag based compositions) and with different aspect ratios were examined. The purpose is to understand the effects
of resistivity decrease and TCR variation caused by the migration of metal particles from the terminations into the
resistor film.The majority of the data were collected by using silver-based terminations since Ag diffusion processes, and then
the relevant electrical effects, are emphasized.Scanning electron microscopy, electron microprobe analysis and X-ray diffraction analysis have been used to
analyze the diffusion processes and the thick-film microstructures. It is shown that the experimental data is simply
explained by a conduction model which assumes percolative tunneling of electrons through conductive grains
embedded in the glass matrix of the resistors. Using simple hypotheses the model theory gives a good quantitative
fit of the experimental results.

A.  Cattaneo

M.  Cocito

F.  Forlani

M.  Prudenziati

Influence of the Metal Migration From Screen-and-Fired Terminations
on the Electrical Characteristics of Thick-Film Resistors

Reliability aspects of Hybrid Microcircuits are considered, including a prediction model illustrating the detail
knowledge of the technology and application necessary. Circuit, part and element data is presented for two different
test circuits. Use is made of predicted circuit failure rates to establish an electrical endurance test programme
together with the thermal stress levels likely to generate some failures in an acceptable time. Results of testing the
circuits at more than one temperature are presented, evaluated and compared with prediction. Failure analysis
enables the performance of add-on parts, circuit elements and bonds to be assessed. A second series of test circuits
confirms an improved bonding system. The usefulness of reliability modelling prior to endurance testing is justified
together with some degree of thermal overstress.

A. H. George

The Reliability, Testing and Evaluation of Hybrid Microcircuits

The physical processes of arc erosive micromachining and the influence of trimming on the parameters of resistors
have been examined, and thin film resistors without trimming are compared with those trimmed by arc erosion and
laser beam machining.In the paper a theoretical model for arc erosion of thin films is proposed. The optimal conditions of arc erosive
trimming are determined. The shape of the cuts are recorded and examined. The applicability of arc erosive
trimming with respect to stability is proved. A measuring method is introduced for resistors trimmed by arc erosion
using a direct current generator.

Zs.  Illyefalvi-Vit&#233;z

Comparison of Arc Erosive and Laser Beam Trimming of Thin Film
Resistors

Teaching activities of the &#8220;Institut Universitaire de Technologie de Lille&#8221; (France) were previously reported.The present paper reports measurement results obtained by students during their last training period for about a
hundred capacitors made with commercial dielectrics (EMCA CDP 400, EMCA CDP 2000, and ESL K 1000).We examine the following points: reproducibility of capacitors during fabrication, correlation between electrical
parameters of components and firing conditions, measurements of capacitance and loss factor between 10 kHz and
20 MHz for temperatures ranging from 20&#176;C to 100&#176;C.

Y.  Leroy

M.  Descamps

M.  Vernet

Characterization of Thick Film Capicitors

A process is described to obtain NiCr resistors with adjustable temperature coefficient of resistance (TCR) by
reactive sputtering in an Ar-atmosphere with a small amount of oxygen in the range of 2&#37; to 6&#37;. As deposited the
films show a TCR &#60; &#8722;200 ppm/K. By heat treatment in air at a temperature of 350&#176;C the TCR can be raised to
values above &#8722;20 ppm/K. The time of heat treatment necessary to obtain a given TCR depends on the oxygen/argon
ratio during sputtering. The long term stability is not affected by the choice of this ratio in a wide range.Resistor networks with a solderable conductor pattern of TiPdAu have a TCR of 0&#177;7 ppm/K and a long term
resistance drift &#8804; 2&#8240; in the first 1,000 hours at 125&#176;C.

J&#252;rgen  Griessing

Reactive Sputtering of NiCr Resistors With Closely Adjustable
Temperature Coefficient of Resistance

Thin film integrated RC-networks can be prepared from two non reactively sputtered TaAl films, the properties
and optimum compositions of which have been found. Temperature compensation of the integrated resistors and
capacitors is achieved by adjusting the temperature coefficient of capacitance. A duplex dielectric capacitor structure
is used with anodically formed TaAl-oxide and a sputtered SiO2 layer. Temperature coefficient of capacitance,
dielectric loss and capacitance density have been measured vs. SiO2 thickness. Because of almost linear dependences
on temperature of both the TaAl resistors and the TaAl-oxide/SiO2-capacitors, such RC-networks show temperature
compensation over a wide temperature range, the TCC being +110 ppm/K and the TCR &#8722;110 ppm/K.

H. W. P&#246;tzlberger

Thin Film Integrated RC-Networks With Compensated Temperature
Coefficients of R and C

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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Active and Passive Electronic Components

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Active and Passive Electronic Components

The First European Hybrid Microelectronics Conference. Part II

The First European Hybrid Microelectronics Conference. Part II

Articles

A New Concept in Calculation of Thick Film Resistors

A High Speed ECL Multiplexer in Beam Lead, Hybrid Technology

Adhesion Measurements of Metallizations for Hybrid Microcircuits

Remarks on Wire and Die Bonding for Hybrid Circuits

Influence of the Metal Migration From Screen-and-Fired Terminations on the Electrical Characteristics of Thick-Film Resistors

The Reliability, Testing and Evaluation of Hybrid Microcircuits

Comparison of Arc Erosive and Laser Beam Trimming of Thin Film Resistors

Characterization of Thick Film Capicitors

Reactive Sputtering of NiCr Resistors With Closely Adjustable Temperature Coefficient of Resistance

Thin Film Integrated RC-Networks With Compensated Temperature Coefficients of R and C