Cemal Basaran received the M.S. degree in civil engineering from the MIT, Cambridge, Ma, USA in 1988 and the Ph.D. degree in civil engineering and engineering mechanics from University of Arizona, Tucson, Ariz, USA in 1994. Since 1995, Dr. Basaran has been with the University at Buffalo (SUNY), Buffalo, NY, USA. In 1994, he was a Visiting Assistant Professor. From 1995 to 1998, he was an Assistant Professor at Electronic Packaging Lab, Mich, USA. From 1999 to 2005, he was an Associate Professor and the Director of the lab. Presently, he is a Professor and the Director of the Electronic Packaging Lab. Dr. Basaran is mainly interested in electronic packaging, reliability of interconnects and interfaces, damage mechanics, finite element method, and experimental mechanics. In 1997, he received the Department of Defense ONR Young Investigator Award and Riefler Award of State University of New York at Buffalo. In 2005, he was the Associate Editor of the Year, ASME Journal of Electronic Packaging. He is the Recipient of the 2011 ASME Electronic Photonic Packaging Excellence in Mechanics Award . In 2008, he was a Fellow of ASME. Presently, He is an Associate Editor of Transactions of ASME, Associate Editor of Journal of Electronic Packaging, Associate Editor of IEEE Transactions on Advanced Packaging, and Associate Editor of ASCE Journal of Nanomechanics and Micromechanics. He is also a Regional Editor for America's International Journal of Materials and Structural Integrity and served for the Editorial Board of The Open Civil Engineering Journal, Journal of Recent Patents on Electrical Engineering, and The Open Numerical Methods Journal. In addition, Dr. Basaran is a Fellow of the American Society of Mechanical Engineers and also a Member of IEEE, IEEE Components, Packaging and Manufacturing Technology Society, and Society for Modeling and Simulation.
Biography Updated on 9 January 2012