Chee Lip Gan

Nanyang Technological University, Singapore


Chee Lip Gan received his B.E. degree in electrical engineering from the National University of Singapore in 1999, and his Ph.D. degree in advanced materials for micro- and nanosystems under the Singapore-MIT Alliance Program (SMA) in 2003. He currently serves as the Director of Temasek Laboratories@NTU, Singapore. He also works as an Associate Professor in the School of Materials Science and Engineering (MSE). He had previously held the position of Assistant Chair of Alumni (2006-2008) and Head of Materials Science Division (2010-2012) in MSE. He was also a Visiting Scientist at Massachusetts Institute of Technology, Cambridge, Mass, USA, (2008-2010), an SMA Fellow (2006-2010) and a Faculty Associate at the Institute of Microelectronics, A*STAR (2007-2011). He is currently also a Renaissance Engineering Programme Fellow at NTU. His current research interests include the reliability study of advanced interconnect systems such as electromigration, stress migration and low-k dielectrics failure mechanisms, bonding and reliability of 3D interconnects and through silicon vias, packaging materials and reliability for ruggedized electronics, and advanced failure analysis and characterization techniques. He is also a past General Chair of International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2010, Technical Chair of IPFA 2008, and currently an Executive Member of IEEE Singapore Reliability/ED/CPMT joint chapter, and IPFA Board Member. He has also served on the conference technical committees of IRPS, ESREF, and IITC.

Biography Updated on 9 June 2012

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