Active and Passive Electronic Components

Table of Contents: 1980

  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 187560

Materials and Applications for Thin Films in Hybrid Microelectronics

G. Zinsmeister
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 791254

Economics and the Market

E. Effenberger
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 7
  • - Article ID 503140

Design and Production of Hybrid Circuit Artwork

A. D. Milne
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 205804

State of the Art in Design and Technology of SAW Devices

P. E. Lagasse
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 230754

New Thick Film Sensors

S. Leppävuori
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 650293

1 GHz Low-Noise Hybrid Preamplifier for Optical Detection

O. Monti | A. Scavennec | P. le Men
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 375619

An Alternative Way of Making Bumps for Tape Automated Bonding

Karel Kopejtko | Jindřich Vilím
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 168085

A Technique for the Measurement of Hot Spots and Isotherm Profiles at the Surfaces of the Elements of Hybrid Microcircuits

F. N. Sinnadurai
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 819865

Hybrid Electronic Watt-Hour Meter

J. Trontelj | L. Trontelj | ... | M. Hrovat
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 968164

Effects of Refiring Processes on Electrical and Structural Properties of Thick-Film Resistors

A. Cattaneo | M. Prudenziati
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 979602

An Installed Tape Automated Bonding Unit

Karel Kurzweil
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 285278

A User Made Thick Film System

M. Honore | R. Govaearts | ... | V. Jansoone
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 201863

Gold-Aluminium Intermetallic Compound Formation

E. Galli | G. Majni | ... | G. Ottaviani
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 7
  • - Article ID 602123

D.C. Sputtering Process: Its Characterization and its Problems When Applied to Tin-Dioxide Thin-Films

Anant G. Sabnis
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 720712

Electrical Transport in Thick Film Resistors

Robert M. Hill
Active and Passive Electronic Components
 Journal metrics
See full report
Acceptance rate10%
Submission to final decision90 days
Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
 Submit Evaluate your manuscript with the free Manuscript Language Checker

We have begun to integrate the 200+ Hindawi journals into Wiley’s journal portfolio. You can find out more about how this benefits our journal communities on our FAQ.