Active and Passive Electronic Components

Table of Contents: 1983

  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 747519

The Influence of Contaminants During the Firing of Inks

A. J. M. Van Gorp | J. H. C. Van Mourik
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 148726

Guidelines for Finer Lines in Thick Film Circuitry

P. J. B. Bertrams | W. Keuper | ... | J. H. C. Van Mourik
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 763405

Hybrids for Automotive Applications

Dietrich Bergfried
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 910246

Silicon and Hybrid Micro-Electronic Sensors

S. Middelhoek | D. J. W. Noorlag | G. K. Steenvoorden
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 710203

Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits

Ch. Zimmer
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 214819

Computer Aided Design of Hybrid Circuits

G. P. Ferraris | T. Cagnin | ... | L. Piana
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 874910

A Short Communication — Determination of Chip and Substrate Temperatures

M. R. Haskard
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 731689

Thin Film Transistors and Thin Film Transistor Circuits

Andre Van Calster
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 434578

Enamelled Steel Substrates for Printed Circuits

R. Kužel | J. Broukal
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 171947

Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects

Carl R. Zimmer
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 518579

Evaluation of Du Pont Copper-Compatible Resistor System

M. V. Coleman | G. E. Gurnett
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 284593

Experimental and Theoretical Characterization of Thick and Thin Films for Microwave Uses on 99.6% Alumina Substrates

J. P. Ramy | R. Schnitzler | C. Thebault
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 723246

Digital Carbon Monoxide Detector /11/

J. P. Dauchot | A. Hecq | M. T. Grognia
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 784976

Ceramic on Metal Substrates Produced by Plasma Spraying for Thick Film Technology

Leszek Gołonka | Lech Pawłowski
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 813860

Experience With Polymer Thick Film Technology

Raimo Hulkkonen | Eero Jarvinen | Vesa Sortti
Active and Passive Electronic Components
 Journal metrics
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Acceptance rate10%
Submission to final decision90 days
Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
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